Universal BGA/Stencils For MTK-Samsung HTC-Huawei Android-Reballing Stencils-Kit

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Universal BGA/Stencils For MTK-Samsung HTC-Huawei Android-Reballing Stencils-Kit

Product Details:-

Part: Universal BGA / Stencils For MTK-Samsung HTC-Huawei Android-Reballing Stencils-Kit

Condition: New

Compatible Brand: For Universal

Type: Stencil

Key Features

Product Description:

100% brand new and high-quality

Made of high-quality materials, durable

These 3 BGA template tin plates are used for Samsung Android Android MTK series chip IC plant tin repair

Package Contents:

1 *BGA pressure welding steel plate for S5026 48 in 1 Samsung

1 *BGA pressure welding mold for A418 Samsung HTC HUAWEI android MTK

1 *BGA pressure welding template for A90 MTK series

More Information
type	Stencils
Item Returns	This item can be returned