MECHANIC iBGA Max BGA Stencil Reballing Kit for iPhone X - 13 series

Key Features:

MECHANIC _ iBGA Max BGA Stencil Reballing Kit for iPhone X/XS/XS MAX/11/11 Pro/11Pro MAX Motherboard Planting and Tin Fixture Platform
--Brand : MECHANIC.
--Item NO : iBGA Max.
--Size : 97*76*20mm.
--LEAK-PROOF TIN DESIGN.
--Support IPX/XS/XS MAX/11/11PRO/11PRO MAX.
--Model : Automatic positioning tin-planting platform for the mid-level motherboard.
--To prevent the tin paste dropped on other parts and Effectively protect the motherborad of mobile phones.
--Automatic positioning, No offset, Accurate and fast, So that the maintenance work efficiency is higher.

Package:
1 * BGA Reballing Platform