MECHANIC 3D BGA Stencil Solder Template for iPhone X reballing stencil

Key Features
MECHANIC _ 3D BGA Stencil Solder Template for iPhone X reballing stencil

Mechanic 3D groove BGA Reballing Stencil Template for iPhoneXS-MAX Middle layer motherboard, iPhone MAX Reballing Stencil Template is used for assisting professionals to do iPhone XS-MAX BGA reballing in the most convenient and safest way

Mechanic 3D XS-M Pro iphone XS MAX Middle Layering BGA Reball Stencil

Made of high temperature resistant synthetic stone
0.3mm thickness, easy to scrape tim, high stength, not easy to deform
Durable, easier to take off the net, more efficient
Mini size, can put under microscope for use,easy to observe
3D Design,stable use, precise plate tin

1.Anti expansion
Adopting the imported material,localized engraving process,and the thickness of 0.3 MMS kept around the groove to ensure that the working area is not easily deformed by heat.

2.Extremely easy to scrape in
Since the thickness of the steel stencil around the working area seaches 0.3MM, the surrounding strength is large,when the hand presses against, the stencil does not deform ,and it's easy to remove the tin.

3.Precision and durability
The thickness of 0.3MM ensures that the items of use of the steel stencil is more than 3 timesof the ordinary one; laser engrave ,the hole is in the shape of a homn,and it is easy to demould.

4.Equipped with special synthetic stone base.
high hardness ,high temperature resistance, light small,?fast and convenient,making maintenance easier