Glue Remover YAXUN 535 20ML BGA IC Epoxy adhesive removing liquid

Product Details:-

Item: Glue Remover YAXUN 535 20ML BGA IC Epoxy adhesive removing liquid

Condition: New

Compatible Brand: For YAXUN 

Type: adhesive removing liquid

Glue Remover Product Description:

Key Features:

YAXUN 535 20ML BGA IC Epoxy Glue Remover adhesive removing liquid for iPhone / Samsung / Any Cell Phone OR ANY DEVICE. This item is used to soften BGA glue , phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. Shake well before use. Take a proper amount of the adhesive removal solution carefully with a pipette, drip it into the sealant required for removal, place the mainboard and BGA IC horizontally for 5--10 minutes to soften the sealant and use a special tool to carefully peel off the soften sealant. Pay attention to the wiring around the BGA IC chip and mobile phone mainboard copper foil circuit when peeling off. Wash off the residual adhesive and solution on the chip mainboard after adhesive removal.

Caution:

This solution is weak acid. There is air pressure in the bottle. Open the bottle cap carefully. Avoid getting into to eyes and skin. In case of that, rinse with lean water. Store in a well-ventilated and low-temperature environment away from sunlight. Keep out of reach of children . It should only be used by professionals. This product is nonflammable.